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Call for Applications: 2025 Dow BEST Symposium

April 30, 2025
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All Day
BEST 2025 Flyer

About

Dow invites outstanding doctoral and postdoctoral scientists to apply by April 30, 2025, for participation in the BEST Symposium – Building Engineering & Science Talent. The BEST Symposium is an industrial research career conference sponsored by Dow and aimed at underrepresented U.S. doctoral and postdoctoral scientists. Applicants must have received a doctorate by November 2026. Please note that Postdocs will be considered if the doctorate was obtained after July 1, 2022.

BEST Symposium participants will:

  • Gain a broader understanding of Dow’s science and technology areas
  • Interact with all levels of R&D scientists & leadership
  • Network with other early career scientists
  • Learn about the skills necessary for a successful career in a global organization
  • Learn what industrial recruiters look for in PhD and Postdoc scientists
  • Be exposed to an array of career opportunities in industrial research
  • For invited candidates, all associated costs will be paid for by Dow (this is a multi-day immersive in-person event) 

Eligibility: 

  • Applicants must have a doctorate degree received by November 2025. For maximum individual benefit, a limited number of applicants will be chosen to participate.
  • Preferred degree areas are chemistry, chemical engineering, materials science, physics, and closely related fields.
  • Research applicable to the focus and topic of the award

Additional Information: 

  • Dow will pay for all associated costs for invited candidates.
  • Participation may lead to future employment opportunities, but it does not guarantee it.
  • Preferred Disciplines Include:
  • Organic Chemistry
  • Inorganic Chemistry
  • Physical Chemistry
  • Analytical Chemistry
  • Polymer Science
  • Materials Science
  • Chemical Engineering
  • Mechanical Engineering
  • Physics
  • Other closely related fields

Submission deadline: Tuesday, April 30th, 2025, at 11:59 PM ET.

Questions? best@dow.com

Location

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